The ZOG Method: True Printed Circuit Boards

Case ID: 18/0031


A novel way to fabricate printed circuit boards without the need of expensive equipment or toxic chemicals.  The circuit board is printed using a 3D printer and liquid metal is used for the circuit traces. Circuits are packaged with plastic and sealed by default.  Multilayer PCBs can also be fabricated without the need of a multi-ton press.  This method allows for the possibility of embedding electronic components within layers, enabling PCB designs to be three dimensional.


Packaged circuit:





  • Low-cost
  • fast iterations
  • non-toxic & environmentally friendly
  • easier fabrication
  • fully packaged



  • safe & cost effective alternative method to make PCBs
  • various filaments can be used to make PCBs with different properties
  • fabricate MEMS devices with 3D printer
  • Microfluidics - use channels for liquid metal traces
  • Optoelectronics - use channels for optical fibers
Patent Information:
David Garmire
Jie Zhou
Tamra Oyama

For information, contact:
Ken Takeuchi
Technology Licensing Associate
University of Hawaii
(808) 956-9749

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